Halarit Composites GmbH

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prepreg products

Adhesive films

Adhesive films are thin epoxy resin films for structural bonding in the aerospace and industrial sectors.
They are cured under pressure and temperature; and they bond metals, composite materials and honeycomb structures to and with each other.

HEXBOND
Suitable for bonding
Weight (g/m²)
TG max. (°C)
Properties and applications
ST 1035
Composite: possible
Metal: recommended
Honeycomb: recommended
150; 300
120
Curing possible from 90°C. Excellent peel strength and shear strength in the range -55°C to 120°C.
679
Composite: recommended
Metal: recommended
Honeycomb: recommended
250
105
Universal application adhesive film for vacuum oven curing from 70°C. Excellent adhesion to metals, GRP, CFRP, rigid foams and honeycombs.
641K
Composite: recommended
Metal: recommended
Honeycomb: recommended
150; 300
175
Curing time 60 min. at 175°C. Excellent peel strength on metals and in sandwich structures. Suitable for thermal loads up to 150°C (permanent) or up to 175°C (short-term). Excellent drapability.
312
Composite: recommended
Metal: recommended
Honeycomb: recommended
150; 300
100
Short curing cycle, e.g. 30 min. at 120°C. For general applications with increased thermal stress.
319
Composite: recommended
Metal: recommended
Honeycomb: recommended
300
150
Curing 60 min. at 175°C. For automotive and aerospace applications.
322
Composite: recommended
Metal: recommended
Honeycomb: recommended
240–380
200
Curing time 60 min. at 175°C. For applications in aviation, motorsport, mechanical engineering and general industrial applications with maximum thermal stress.
212-NA
Composite: recommended
Metal: recommended
Honeycomb: recommended
1.850
100
Foaming adhesive film. For filling cavities and joining aluminium and Nomex honeycomb panels.
TEXIPREG
Suitable for bonding
Weight (g/m²)
TG max. (°C)
Properties and applications
EA451
Composite: recommended
Metal: recommended
Honeycomb: recommended
75; 100; 150; 185; 300
190
Flexible curing between 90 and 180°C. For structural bonding and sandwich bonding; X-ray transparent.